Work Experience & Education

 

VP of Engineering, Technetix

August  2022 - Present

Member of the Executive Team.

 

Senior Director & Country Manager, Connectivity Hardware Engineering, Codecs, DSP, & Applications at Dialog Semiconductor, a Renesas company

April  2019 - August 2022

Working together with a highly skilled international team of ~160 Engineers, Leads and Managers on integrated low power wireless audio, Codecs, DSP solutions, voice and connectivity products, SoC designs, reference designs, production tools, quality assurance and applications. Multi-site & multi-disciplinary teams located in The Netherlands, Scotland, Greece, Phoenix, USA and Taiwan. Working closely together with BU IOT-WiFi in Korea.

Member of the Business Group management team.

Country Manager The Netherlands, since April 2022

Senior Director, Connectivity Hardware Engineering & Applications at Dialog Semiconductor

November 2018 - Present

Working together with a highly skilled team of +110 Engineers on integrated low power wireless audio, voice and connectivity products, SoC designs, reference designs, production tools, quality assurance and applications. Multi-site & multi-disciplinary teams located in The Netherlands, Greece, Phoenix, USA and Taiwan. Member of the Business Group management team.

Senior Director, Connectivity Hardware Engineering at Dialog Semiconductor

October 2016 - October 2018

Dialog brings decades of experience to the rapid development of ICs while providing flexible and dynamic support, world-class innovation and the assurance of dealing with an established business partner. We continue to lead through innovation and diversification as a socially
responsible employer pursuing many programs to benefit the employees, community, stakeholders and the environment we operate in. Dialog: Building a vibrant and innovative mixed-signal business. Working together with and for a team of +60 professionals on low power wireless audio, voice and highly integrated connectivity products. Multi-site & multi-disciplinary teams located in The Netherlands, Greece and Phoenix, USA.

VP Product Development, Director, Analog/RF IC Design at GreenPeak Technologies B.V.

December 2011 - September 2016

GreenPeak (GP) is a leader in RF communication technology for wireless connected home applications,   offering innovative ultra-low power wireless data communication controller chips for smart home applications for remote controls, energy efficiency, lighting, heating and HVAC, access control and security, in short, a wide range of smart home applications. Responsible for the hardware (Analog/RF and digital) and (core) software development of GreenPeak’s ASICs. Member of the MT. Contributed to the roadmap definition, continuous quality improvements and next generation system definition and presentations to the GreenPeak board members. Furthermore, contributed to the system design, circuit design, design reviews, and layout of the GP565, GP502, GP712 and GP651. From December 2011 until March 2014: Director, Analog/RF IC Design ( /ULP Radio Research), Leading the Analog/RF IC design team & contributing to Ultra Low Power Radio Research &Development, Design & Layout for next generation GP radios. Qorvo acquired GreenPeak in April 2016 and GreenPeak became the Low Power Wireless Business Unit of Qorvo's IDP division. Director, Product Development, until October 2016.

Senior Principal Scientist / Broadband RF group lead at Broadcom

October 2007 - November 2011

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. Contributed to RF group build up, and a number of successful wired transceiver product designs and low power wireless chip building blocks including a programmable 3rd order Butterworth active filter for Multi-media over Cable Transceivers (MoCA) (65nm). A 0.9-1.2GHz programmable integer-N PLL (40nm). A MoCA direct-conversion transmitter with image, LO-feedthrough & TX gain calibration (40nm, ISSCC 2011). And a 5GS/s TX DAC for outdoor satellite units (40nm, ESSCIRC 2012, JSSC 2013).

Senior Researcher at Holst Centre

December 2006 - October 2007

Holst Centre is an independent open-innovation R&D centre that develops generic technologies for Wireless Autonomous Sensor Technologies and for Flexible Electronics. A key feature of Holst Centre is its partnership model with industry and academia around shared roadmaps and programs. Contributed to Narrow Band and Ultra Wideband (UWB) low power wireless radio IC design activities, including ULP frequency hopping synthesizers (ISSCC 2009) and building blocks for UWB wideband transmitters.

Part-time Associate professor at University of Twente

November 2005 - December 2006

Integrated Circuit Design (ICD) group is part of the department of Electrical Engineering of the University of Twente. The main subject of the ICD group education and research program is the design of integrated circuits, with a focus on CMOS low power wireless Transceivers.
Contributed to the build up of the (low power) Wireless Transceiver Electronics Course, and lecturing parts of it for a number of years. Part-time, one day per week, while working at ITOM.

Research Officer at

February 2003 - December 2006

ItoM is an applied research lab that develops chip solutions for a wide range of mobile devices. Its output consist of Patents, test chips, fully industrialized IC's for your production technology, FPGA's and dedicated embedded software. Worked on the design of a high performance low power LC oscillator for FM receivers ( ISSCC 2003). Supervision (4 person team) and major contributions to the RF Front-end design and layout of a 0.1 to 1 GHz mobile TV receiver in 0.6um BICMOS (ISSCC 2005). Tuning system design (3-4GHz digitally controlled oscillator, divider chains, and front-end) and the layout of a 100 MHz FM radio receiver in 65nm CMOS. Presenting technology and designs to customers such as Nokia, Sanyo, and ST. During January 2003 to February 2005, one day per week consultant at ItoM, while working fulltime at Eindhoven University of Technology (TU/e); after Feb. 2005 full-time at ItoM.

Assistant professor at TU/e

February 2000 - February 2005

Mixed-signal Microelectronics (MSM) Group is part of the department of Electrical Engineering, of the Eindhoven University of Technology. The MsM group is working in the area of mixed-signal microelectronics.

○ Contributions to Education:

Built-up from scratch of lecture (and giving this course) “Electronics 4”, 3rd year BSc course (awarded price for best educational material). Initiated and built up from scratch the optional course low power wireless “Integrated RF transceivers” (MSc. Course). Supervisor of numerous MSc.students, and Trainees. Daily mentor and co-promoter of four successful Ph.Ds.

○ Contributions to RF IC Research and Design:

Built-up from scratch of the scientific RF IC design activities. This includes CAD & compute server infrastructure, measurement lab, and all of the RF IC research activities. Raised project funding over the years 2003-2004 (BSIK, IOP GenCom proposals, consulting, bilateral projects, lead user funding) Scientific contributions in the form of conference & journal publications, book chapters and books.

Research Scientist at Philips

September 1995 - February 2000

Philips Research Laboratories: Now NXP Research. Topics under research included analog integrated RF and Microwave key building-blocks for satellite, television, radio and optical front-ends. In particular, mixers, filters and oscillators (ISSCC 1997) were subject of investigation in the frequency range from low frequencies to 12 GHz.

Education

Awards: